Microelectronic systems and the associated packaging technology are the key technology of current and future mobility solutions. Increasing miniaturization of electronic systems combined with increasing performance and lifetime require the development of new reliable materials, improvement of existing assembly and interconnection techniques as well as the extension of existing analysis and test methods. The focus of our research is on applications in optoelectronics (LED modules) and power electronics.

Due to our close cooperation with various companies from the automotive industry, packaging and interconnection technology, optics manufacturers and many more in different research cooperations, we work very close to the application and always on the most current topics of microelectronics and packaging and interconnection technology. In addition, this enables our students to gain initial insights into possible professional fields in the aforementioned research areas.

Reliable operation of electronic systems over their lifetime is essential. This must be ensured, especially in the automotive sector with its high safety requirements. High operating temperatures and strong mechanical and thermomechanical stress influence the reliability of the systems and require advanced and reliable assembly and interconnection technologies.

 

Research Highlights

Research Projects

Laboratory

Team

Publications

Research Collaborations and Cooperation

We in the research group "Microelectronic Packaging" headed by Prof. Dr. Gordon Elger build electronic systems and test them for reliability in our laboratories in accelerated aging tests (for example under temperature cycling conditions).

Using state-of-the-art methods (Raman spectroscopy, ultrasound, ...), we then analyze the tested components for failure patterns and failure mechanisms.

In addition to existing analysis methods, our research group is developing its own electrical test methods with which the reliability of electronic components can be measured non-destructively in-situ and ex-situ (Automated Transient Thermal Analysis).

Using finite element (FE) and computational fluid dynamics (CFD) methods, we simulate the physical relationships of electronic systems and can thus decisively optimize their thermal management, for example.

Our research group currently comprises around 7 scientific employees, who in turn are supported by numerous student employees, bachelor's and master's students. 

 

Offers for students in the Microelectronic Packaging research group

TopicSupervisorType
Aufbau eines Hardware in the Loop Teststand für Leistungselektronische ModuleMaximilian SchmidForschungsmaster
Aufbau eines Power-Cycling Teststand für Leistungselektronische ModuleMaximilian SchmidForschungsmaster
Analysis of Creep behavior and development of the material model of AuSn solder joints using simulation and Raman spectroscopyZubair Akthar MohdBachelor-/Master Thesis
Creation of reduced Order Thermal LED ModelsAndreas ZippeliusMaster Thesis

 

Contact

Head of Fraunhofer Application Center "Connected Mobility and Infrastructure"; Research Professor Assembly and Connection Technology
Prof. Dr. Gordon Elger
Phone: +49 841 9348-2840
Room: A114
E-Mail:

Open positions

If you are interested in vacancies for student work within the research group, please send an email with CV to assistenz-iimo-elger.de.