Project description

In the project, test fixtures and test concepts for modular radar sensors based on chiplet technology are developed. AEC-Q100 and JESC22 are standard automotive test procedures, which we use as a guideline for the reliability investigation of the radar sensors. At the same time, new methods for reliability testing of ball grid array chip interconnects are developed and investigated. In addition to thermomechanical simulations, methods for the reliability investigation of ball grid array solder joints for chips are also being developed and investigated.

 

Project information

Tasks THIReliability and functional analysis of the created demonstrator with the help of daisy chain compenents.
Project partnerUniversität Bremen, Conti Temic Microelectronics GmbH, Fraunhofer FHR, Fraunhofer IZM, Infineon Technologies AG, Ruhr Universität Bochum, Technische Hochschule Ingolstadt
Project sponsorFederal Ministry of Education and Research
Project term01/05/2021 until 31/10/2024

 

Contact

Head of Fraunhofer Application Center "Connected Mobility and Infrastructure"; Research Professor Assembly and Connection Technology
Prof. Dr. Gordon Elger
Phone: +49 841 9348-2840
Room: A114
E-Mail:

Open positions

If you are interested in vacancies for student work within the research group, please send an email with CV to assistenz-iimo-elger.de.